Electronic substrates are foundational components in modern electronic packaging. From ceramic-based circuits to semiconductor interposers, surface precision and cleanliness are critical to performance. Our silicon carbide and alumina abrasives are engineered to deliver controlled material removal and submicron-level smoothness for materials like alumina, aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass ceramics.
Silicon carbide and white fused alumina deliver flatness control and minimal surface damage on Al₂O₃, AlN, and Si₃N₄ substrates.
Fine abrasives prevent micro-chipping and delamination during edge trimming of glass-based substrates.
Alumina abrasives remove smear and prepare ceramic via holes for reliable metallization.
Micro-polishing with high-purity abrasives improves adhesion of Cu or Ag metallization layers.
Precision abrasive slurries enable ultra-thin silicon or ceramic substrate reduction while maintaining structural integrity.
Selective abrasive systems help remove temporary surface layers without scratching the underlying substrate.
| Material | Grit Size Range | Application | Purity | Key Characteristics |
|---|---|---|---|---|
| Green Silicon Carbide | F400–F1200 | Ceramic lapping, thin wafer prep | ≥99.5% | High hardness, precise removal |
| White Fused Alumina | F600–F1200 | Surface prep, metallization cleaning | ≥99.0% | Low contamination, high polish |
| Calcined Alumina | 0.3μm–5μm | Polishing, glass edge smoothing | ≥99.9% | Controlled PSD, minimal scratches |
| Property | Green SiC | White Fused Alumina | Calcined Alumina |
|---|---|---|---|
| Hardness | 9.5 Mohs | 9.0 Mohs | 8.8 Mohs |
| Surface Finish | Fine | Very Fine | Ultra-Fine |
| Impurity Risk | Low | Very Low | Extremely Low |
| Compatibility with Ceramics | Excellent | Good | Excellent |
Client: Advanced substrate manufacturer for power electronics
Challenge: Improve flatness and surface roughness of AlN substrates for multilayer packaging
Solution: Implemented multi-step SiC and alumina process using 3μm calcined alumina slurry for final polish
Green SiC and calcined alumina are ideal for AlN, Al₂O₃, and Si₃N₄ substrates due to their hardness, purity, and ability to achieve uniform finish without subsurface damage.
Yes. We provide CMP-compatible abrasive slurries with stable suspension characteristics, narrow PSD, and minimal agglomeration.
Absolutely. Our ultra-pure abrasives undergo third-party analysis and are free from conductive impurities, ensuring safety in microelectronics and packaging lines.
Looking to improve your substrate process yield or surface uniformity? Contact our materials engineering team for tailored recommendations and sample delivery.
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