The performance of bonded abrasives significantly impacts the surface roughness, uniformity, and machining efficiency of processed workpieces. Factors such as abrasive particle size, binder type and content, and filler materials are crucial to the performance of bonded abrasives, drawing significant attention from researchers.
1. Impact of Abrasive Particle Size on Quartz Glass Processing Performance
Currently, the material removal efficiency in the grinding process of quartz glass is unstable, especially when using diamond agglomerated bonded abrasives. There is limited research on how particle size and processing performance impact bonded abrasive pads. Researchers, including Ling Shunzhi, have explored the effects of primary and secondary particle sizes of diamond agglomerates, grinding pressure, and slurry flow on the grinding characteristics of bonded abrasives for quartz glass.
The research selected the primary particle size (initial particle size) and secondary particle size (sintered particle size) of diamond agglomerated abrasives as key factors influencing grinding performance.
(1) Primary Particle Size of Diamond Agglomerates: When the primary particle size of diamond agglomerated abrasives changes from 0.5–1.0 µm to 1.0–2.0 µm, the material removal rate increases from 393.2 nm/min to 2541 nm/min, a 5.2-fold improvement. The surface roughness Ra increases from 0.077 µm to 0.087 µm.
(2) Secondary Particle Size of Diamond Agglomerates: As the secondary particle size increases, the material removal rate initially increases and then decreases, as observed in the data.
2. Impact of Abrasives on TC4 Titanium Alloy Grinding
Researchers, such as Wang Jianjie, studied the effects of various abrasive types and particle sizes on the material removal rate and surface quality during titanium alloy grinding. They found that:
- Diamond abrasives result in wider scratches on the workpiece surface, with more noticeable grinding pits as the particle size increases. Due to the high hardness of diamonds, they are less likely to wear or fracture, and the larger diamond abrasives tend to roll and create pits on the surface.
- Diamond and silicon carbide abrasives of larger particle sizes result in higher material removal rates, but at the same particle size, the difference in removal rates between diamond and silicon carbide is minimal.
- With larger abrasive particle sizes, the surface roughness increases due to deeper penetration and wider scratches. At the same size, diamond abrasives tend to cause higher surface roughness than silicon carbide abrasives.
The study recommends using silicon carbide abrasives with particle sizes between 20–30 µm for the best combination of high material removal rate and minimal surface roughness.
3. Effect of Polishing Liquid Components on Copper Processing Performance
Polishing of copper materials can be done through chemical polishing, electrochemical polishing, and mechanical polishing. Chemical polishing can release harmful gases such as NO and NO2, posing risks to workers and the environment. Electrochemical polishing often results in uneven brightness, with surface pits and stripes. Mechanical polishing may cause metal surface distortion and non-uniformity.
Chemical Mechanical Polishing (CMP) combines both mechanical and chemical effects for micro-removal of materials. This method involves both free abrasive polishing and bonded abrasive polishing. Free abrasives result in uneven distribution and uncontrollable movement, leading to poor surface accuracy and low abrasive efficiency. Bonded abrasive polishing, however, ensures uniform distribution of abrasives, reducing environmental contamination and lowering processing costs.
Effect of Hydrogen Peroxide Concentration: The addition of hydrogen peroxide to the polishing solution significantly reduces the friction coefficient and improves material removal rate, as hydrogen peroxide forms an oxide layer on the copper surface, which is easier to remove than pure copper debris.
Effect of Ethylenediamine Concentration: The addition of ethylenediamine results in an increase in surface roughness due to the corrosion effect on copper ions. At higher concentrations, the polishing efficiency improves, and the surface becomes smoother with less abrasive wear.
4. Effect of Substrate Hardness on Bonded Abrasive Polishing of YAG Crystals
Yttrium aluminum garnet (YAG) crystals have excellent optical properties and a wide range of applications in fields such as laser fusion and space debris removal. However, they are challenging to process due to their high hardness and brittleness. Polishing YAG crystals requires high precision to avoid defects.
The use of bonded abrasives for YAG crystal polishing improves selectivity and flatness, while avoiding glazing and reducing environmental impact.
5. Effect of Slurry on SiC Workpiece Grinding
SiC is a typical wear-resistant and corrosion-resistant material. The addition of slurry significantly increases material removal rate during fine grinding. Using slurry improves the removal rate by 5 times and stabilizes the process.
